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TLRH17TP 数据表(PDF) 2 Page - Toshiba Semiconductor

部件名 TLRH17TP
功能描述  Panel Circuit Indicator
PDF  8 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  TOSHIBA [Toshiba Semiconductor]
网页  http://www.semicon.toshiba.co.jp/eng
标志 TOSHIBA - Toshiba Semiconductor

TLRH17TP 数据表(HTML) 2 Page - Toshiba Semiconductor

  TLRH17TP Datasheet HTML 1Page - Toshiba Semiconductor TLRH17TP Datasheet HTML 2Page - Toshiba Semiconductor TLRH17TP Datasheet HTML 3Page - Toshiba Semiconductor TLRH17TP Datasheet HTML 4Page - Toshiba Semiconductor TLRH17TP Datasheet HTML 5Page - Toshiba Semiconductor TLRH17TP Datasheet HTML 6Page - Toshiba Semiconductor TLRH17TP Datasheet HTML 7Page - Toshiba Semiconductor TLRH17TP Datasheet HTML 8Page - Toshiba Semiconductor  
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TLRH17TP(F),TLRMH17TP(F),TLSH17TP(F),TLOH17TP(F),TLYH17TP(F)
2009-11-30
2
Electrical and Optical Characteristics (Ta = 25°C)
Emission Wavelength
Luminous Intensity
IV
Forward Voltage
VF
Reverse
Current
IR
λd
λP
Δλ
Product Name
Min
Typ.
Max
Typ.
Typ.
IF
Min
Typ.
IF
Typ.
Max
IF
Max
VR
TLRH17TP(F)
630
644
13
20
850
2000
20
1.9
2.4
20
50
4
TLRMH17TP(F)
626
636
13
20
850
3200
20
1.9
2.4
20
50
4
TLSH17TP(F)
613
623
13
20
1530
4500
20
2.0
2.4
20
50
4
TLOH17TP(F)
605
612
13
20
1530
5000
20
2.0
2.4
20
50
4
TLYH17TP(F)
581
587
595
590
13
20
1530
4800
20
2.0
2.4
20
50
4
Unit
nm
mA
mcd
mA
V
mA
μA
V
Precautions
Please be careful of the following:
• Soldering temperature: 260°C max, soldering time: 3 s max
(Soldering portion of lead: up to 1.6 mm from the body of the device)
• If the lead is formed, the lead should be formed up to up to 1.6 mm from the body of the device without forming
stress to the resin. Soldering should be performed after lead forming.
• This visible LED lamp also emits some IR light.
If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light.



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