TL(RH,OH,YH)62T(F)

2008-12-26

2

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note1: Forward current derating

Typ. Emission Wavelength

Luminous Intensity

Forward Voltage

Reverse Current

Part Number

Δλ

Min

Typ.

Typ.

Max

Max

TLRH62T(F)

630

644

13

20

47.6

180

20

1.9

2.4

20

50

4

TLOH62T(F)

605

612

13

20

153

550

20

2.0

2.4

20

50

4

TLYH62T(F)

587

590

13

20

153

400

20

2.0

2.4

20

50

4

Unit

nm

mA

mcd

mA

V

mA

V

Precautions

Please be careful of the following:

• Soldering temperature: 260°C max, soldering time: 3 seconds max

(Soldering portion of lead: up to 1.6 mm from the body of the device)

• If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming stress

to the resin. Soldering should be performed after lead forming.

• This visible LED lamp also emits some IR light.

If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light.

Part Number

Forward Current

Reverse Voltage

Power Dissipation

Operating

Temperature

Storage Temperature

TLRH62T(F)

TLOH62T(F)

TLYH62T(F)

50

4

120

−40 to 100

−40 to 120

Ambient temperature Ta (°C)

0

60

0

40

80

20

120

20

40

60

80

100