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BGA461 数据表(PDF) 5 Page - Infineon Technologies AG |
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BGA461 数据表(HTML) 5 Page - Infineon Technologies AG |
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5 / 8 page ![]() BGA461 Description Preliminary Data Sheet 5 Rev.1.1, 2009-01-22 Pin Definition and Function Maximum Ratings Thermal resistance Type Package Marking BGA461 TSLP-7-4 BU Table 1 Pin Definition and Function Pin No. Symbol Function 1 IN LNA RF input 2BIAS DC bias 3 n.c. not used 4 PON Power on control 5 VCC DC Supply 6 OUT LNA RF output 7 GND DC & RF ground Table 2 Maximum Ratings Parameter 1) 1) All voltages refer to GND-Node. Symbol Value Unit Voltage at pin VCC V CC -0.3 ... 3.6 V Voltage at pin IN V IN -0.3 ... 0.9 V Voltage at pin BIAS V BIAS -0.3 ... 0.9 V Voltage at pin OUT V OUT -0.3 ... V CC+ 0.3 V Voltage at pin PON V PON -0.3 ... V CC+ 0.3 V Current into pin VCC I CC 10 mA RF input power P IN 10 dBm Total power dissipation, T S < 139 °C 2) 2) T S is measured on the ground lead at the soldering point P tot 90 mW Junction temperature T J 150 °C Ambient temperature range T A -30 ... 85 °C Storage temperature range T STG -65 ... 150 °C ESD capability all pins (HBM: JESD22A-114) V ESD 1000 V Table 3 Thermal resistance Parameter Symbol Value Unit Junction - soldering point 1) 1) For calculation of R thJA please refer to Application Note Thermal Resistance R thJS 125 K/W |
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