ADP2147

Rev. 0 | Page 16 of 16

OUTLINE DIMENSIONS

A

B

C

0.640

0.595

0.550

0.370

0.355

0.340

0.270

0.240

0.210

1.070

1.030

0.990

1.545

1.505

1.465

1

2

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

SIDE VIEW

0.340

0.320

0.300

1.00

REF

0.50

REF

BALL A1

IDENTIFIER

SEATING

PLANE

0.50 REF

COPLANARITY

0.05

Figure 38. 6-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-6-12)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature

Range

(VSEL = 0)

(VSEL = 1)

Package Description

Package

Option

Branding

ADP2147ACBZ-110-R7

−40°C to +125°C

1.275

0.981

6-Ball Wafer Level Chip Scale Package [WLCSP]

CB-6-12

LLE

ADP2147ACBZ-130-R7

−40°C to +125°C

0.9

1.3

6-Ball Wafer Level Chip Scale Package [WLCSP]

CB-6-12

LLF

ADP2147ACBZ-150-R7

−40°C to +125°C

1.2

1.0

6-Ball Wafer Level Chip Scale Package [WLCSP]

CB-6-12

LLG

ADP2147ACBZ-170-R7

−40°C to +125°C

0.9

1.1

6-Ball Wafer Level Chip Scale Package [WLCSP]

CB-6-12

LLH

ADP2147CB-110EVALZ

Evaluation Board

ADP2147CB-130EVALZ

Evaluation Board

ADP2147CB-150EVALZ

Evaluation Board

ADP2147CB-170EVALZ

Evaluation Board

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registered trademarks are the property of their respective owners.

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