SSM2377

Rev. 0 | Page 15 of 16

OUTLINE DIMENSIONS

A

B

C

0.645

0.600

0.555

1.280

1.240 SQ

1.200

1

2

3

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

END VIEW

0.300

0.260

0.220

0.80

REF

0.80

REF

0.40

REF

0.415

0.400

0.385

SEATING

PLANE

0.230

0.200

0.170

COPLANARITY

0.05

BALL A1

IDENTIFIER

Figure 37. 9-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-9-4)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option2

Branding

SSM2377ACBZ-RL

−40°C to +85°C

9-Ball Wafer Level Chip Scale Package [WLCSP]

CB-9-4

Y48

SSM2377ACBZ-R7

−40°C to +85°C

9-Ball Wafer Level Chip Scale Package [WLCSP]

CB-9-4

Y48

EVAL-SSM2377Z

Evaluation Board