KP236

Analog Absolute Pressure Sensor

Package Information

Data Sheet

22

Revision 1.0, 2010-06-21

4

Package Information

The PG-DSOF-8-16 package is optimized regarding external mechanical stress influences. The package fulfills

the solder conditions for lead-free board assembly. Details (soldering profile, application notes, etc.) are available

under:

Note: In the application, it is recommended to ensure that the same pressure is applied to the whole package.

4.1

PG-DSOF-8-16 Outline

Figure 11

Package outline (all dimensions in mm)

OUTER DIMENSIONS DOES NOT INCLUDE PROTUSION

OR INTRUSION OF 0.2 MAX. PER SIDE