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DRF1201 数据表(PDF) 2 Page - Microsemi Corporation

部件名 DRF1201
功能描述  MOSFET Driver Hybrid
PDF  4 Pages
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制造商  MICROSEMI [Microsemi Corporation]
网页  http://www.microsemi.com
标志 MICROSEMI - Microsemi Corporation

DRF1201 数据表(HTML) 2 Page - Microsemi Corporation

  DRF1201 Datasheet HTML 1Page - Microsemi Corporation DRF1201 Datasheet HTML 2Page - Microsemi Corporation DRF1201 Datasheet HTML 3Page - Microsemi Corporation DRF1201 Datasheet HTML 4Page - Microsemi Corporation  
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DRF1201
MOSFET Absolute Maximum Ratings
Symbol
Parameter
Min
Typ
Max
Unit
BV
DSS
Drain Source Voltage
1000
V
I
D
Continuous Drain Current T
HS = 25°C
26
A
R
DS(on)
Drain-Source On State Resistance
0.55
Ω
T
jmax
Operating Temperature
175
°C
MOSFET Dynamic Characteristics
Symbol
Parameter
Min
Typ
Max
Unit
C
iss
Input Capacitance
2000
pF
C
oss
Output Capacitance
165
C
rss
Reverse Transfer Capacitance
75
MOSFET Thermal Characteristics
Symbol
Parameter
Min
Typ
Max
Unit
JC
Thermal Resistance Junction to Case
0.53
°C/W
JHS
Thermal Resistance Junction to Heat Sink
0.141
T
JSTG
Storage Temperature
-55 to 150
°C
P
DHS
Maximum Power Dissipation @ T
SINK = 25°C
1060
W
P
DC
Total Power Dissipation @ T
C = 25°C
2830
Microsemi reserves the right to change, without notice, the specifications and information contained herein.
Figure 1, DRF1201 Simplified Circuit Diagram
The Simplified DRF1201 Circuit Diagram is illustrated above. By including the driver high speed by-pass capacitor (C1), the contribution to
the internal parasitic loop inductance of the driver output is greatly reduced. This, coupled with the tight geometry of the hybrid, allows optimal
gate drive to the MOSFET. This low parasitic approach, coupled with the Schmitt trigger input (IN), Kelvin signal ground (SG) and the Anti-
Ring Function, provide improved stability and control in Kilowatt to Multi-Kilowatt, high Frequency applications. Both the FN and IN pins are
referenced to the Kelvin ground (SG.) The signal is then applied to the intermediate drivers and level shifters; this section contains proprietary
circuitry designed specifically for the ring abatement. The power drivers provide high current to the gate of the MOSFETS.
Symbol
Parameter
Min
Typ
Max
Unit
C
out
Output Capacitance
2500
pF
R
out
Output Resistance
.8
Ω
L
out
Output Inductance
3
nH
F
MAX
Operating Frequency CL = 3000nF + 50Ω
30
MHz
F
MAX
Operating Frequency RL = 50Ω
50
Driver Output Characteristics
Symbol
Parameter
Min
Typ
Max
Unit
JC
Thermal Resistance Junction to Case
1.5
°C/W
JHS
Thermal Resistance Junction to Heat Sink
2.5
T
JSTG
Storage Temperature
-55 to 150
°C
P
DJHS
Maximum Power Dissipation @ T
SINK = 25°C
60
W
P
DJC
Total Power Dissipation @ T
C = 25°C
100
Driver Thermal Characteristics



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