STESD07

Plastic Encapsulate ESD Protection Diodes

Elektronische Bauelemente

14-Apr-2010 Rev. A

Page 1 of 2

http://www.SeCoSGmbH.com/

Any changes of specification will not be informed individually.

DESCRIPTION

The STESD07 is designed to protect voltage sensitive

components from ESD. Excellent clamping capability, low leakage,

and fast response time provide best in class protection on designs that

are exposed to ESD. Because of its small size, it is suited for use in

cellular phones, MP3 players, digital cameras and many other portable

applications where board space is at a premium.

APPLICATIONS



Stand-off voltage: 7V



Low Leakage



Response Ttime is Typically < 1 ns



ESD Rating of Class 3 (>16kV) per Human Body Model



IEC61000-4-2 level 4 ESD protection



These are Pb-Free Devices

DEVICE MARKING: X7

PARAMETER

SYMBOL

VALUE

UNIT

IEC 61000-4-2 (ESD)

Contact

±30

KV

ESD voltage

Per Human Body Model

16

KV

Per Machine Model

400

V

Total power dissipation on FR-5 Board (Note 1)

100

mW

Thermal Resistance Junction−to−Ambient

1250

°C / W

Junction and Storage Temperature Range

-55 ~ +150

°C

Lead Solder Temperature – Maximum (10 Second Duration)

260

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended. Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. FR-5 = 1.0 x 0.75 x 0.62 in.

ELECTRICAL CHARACTERISTICS

PARAMETER

SYMBOL

MIN

TYP

MAX

UNIT

Working Peak Reverse Voltage

-

-

7.0

V

-

-

1.0

μA

7.5

-

8.7

V

Test Current

-

-

1.0

mA

Maximum Reverse Peak Pulse Current (Note3)

-

-

8.0

A

-

-

15.1

V

Peak Power Dissipation (8 X 20 μs)

-

115

-

W

C

-

55

-

pF

2.

3.

Surge current waveform per Figure 3.

RoHS Compliant Product

A suffix of “-C” specifies halogen & lead-free