SUPERWORLD ELECTRONICS (S) PTE LTD

NOTE : Specifications subject to change without notice. Please check our website for latest information.

PG. 7

30.08.2010

L811HW SERIES

10. RELIABILITY AND TEST CONDITION :

TEST CONDITION

PERFORMANCE

ITEM

directions (Total 6 hours).

10±0.5

seconds

60

seconds

defects harmful to the characteristics should not

No disconnection or short circuit.

2. Inductance : Within ±20% of initial value.

1. Appearance : No damage

Appearance : Cracking, shipping and any other

be allowed.

Random Vibration Test

Humidity Resistance

No disconnection or short circuit.

2. Inductance : Within ±20% of initial value.

1. Appearance : No damage

Low Temperature

Thermal Shock

Life Test

Reliability Test

High Temperature

Life Test

+125±3

330±3

Measure at room temperature after placing for 2 to 3 hrs.

Measure at room temperature after placing for 2 to 3 hrs.

Directions & times : X, Y, Z directions for 2 hours.

A period of 2 hours in each of 3 mutually perpendicular

Within 3

Applied Current : Rated Curent

Time : 500±12 hours

Amplitude : 1.52mm

Frequency : 10-55-10Hz for 1 min.

Total : 5 cycles

Temperature : 40±5°C

Humidity : 90% to 95%

Room Temperature

4

Measure at room temperature after placing for 2 to 3 hrs.

Measure at room temperature after placing for 2 to 3 hrs.

30±3

Within 3

Times (min.)

Temperature : -55±5°C

Time : 500±12 hours

Conditions of 1 cycle.

Room Temperature

Temperature (°C)

Step

2

1-55±3

Temperature : 125±5°C

Time : 500±12 hours

should be covered with solder.

1. Appearance : No significant abnormality

2. Inductance change : Within ±20%

Solder Heat Resistance

Preheating

260°C

150°C

Natural

Dipping

cooling

60

seconds

Preheating

150°C

245°C

4±1

seconds

Dipping

cooling

Natural

More than 90% of the terminal electrode

Refer to standard electrical characteristics list

Saturation Current (Isat)

Mechanical Performance Test

Solderability Test

Heat Rated Current (Irms)

Electrical Characteristics Test

DCR

Inductance

Solder : Sn99.95-Cu0.05

Preheat : 150°C, 60sec.

Dip Time : 10±0.5sec.

Solder Temperature : 260±5°C

Flux for lead free : rosin

Solder : Sn99.95-Cu0.05

Solder Temperature : 245±5°C

Dip Time : 4±1sec.

Flux for lead free : rosin

2. Temperature measured by digital surface thermometer

Isat(A) will cause Lo to drop approximately 20% typ.

CH16502, Agilent33420A Micro-Ohm Meter.

HP4284A, CH11025, CH3302, CH1320, CH1320S

approximately

T=40°C without core loss

Irms(A) will cause the coil temperature rise

1. Applied the allowed DC current

Preheat : 150°C, 60sec.

LCR meter.

HIGH CURRENT MOLDED POWER INDUCTORS