Recovery : 4 to 24hrs of recovery under the standard

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 4

defects harmful to the characteristics should not

Appearance : Cracking, chipping and any other

NOTE : Specifications subject to change without notice. Please check our website for latest information.

Random Vibration Test

be allowed.

Humidity Resistance

2. Inductance : Within ± 20% of initial value.

No disconnection or short circuit.

1. Appearance : No damage

Frequency : 10-55-10Hz for 1 min.

A period of 2 hours in each of 3 mutually perpendicular

Directions and times : X, Y, Z directions for 2 hours.

Amplitude : 1.52mm

directions (Total 6 hours).

08.04.2011

Recovery : 4 to 24hrs of recovery under the standard

Applied Current : Rated Current

condition after the removal from test chamber.

Time : 500± 12 hours

condition after the removal from test chamber.

Humidity : 90% to 95%

Temperature : 40± 5° C

2. Inductance : Within ± 20% of initial value.

Thermal Shock

No disconnection or short circuit.

Low Temperature

High Temperature

Life Test

Life Test

Reliability Test

1. Appearance : No damage

Room Temperature

Room Temperature

85± 3

4

Total : 5 cycles

3

2

Within 3

30± 3

Within 3

condition after the removal from test chamber.

Temperature (° C)

Conditions of 1 cycle.

-25± 3

Step

1

Times (min.)

30± 3

Recovery : 4 to 24hrs of recovery under the standard

Recovery : 4 to 24hrs of recovery under the standard

condition after the removal from test chamber.

Time : 500± 12 hours

Temperature : -40± 5° C

Time : 500± 12 hours

Temperature : 125± 5° C

2. Inductance change : Within ± 20% of initial value

Solder Heat Resistance

1. Appearance : No significant abnormality

Mechanical Performance Test

Saturation Current (Isat)

Solderability Test

More than 90% of the terminal electrode

should be covered with solder.

After fluxing, component shall be dipped in a melted

Dipping

10± 0.5

seconds

Dip Time : 10± 0.5sec.

Flux : rosin

60

seconds

150° C

260° C

Preheating

solder bath at 245± 5° C for 5 secs

Solder Temperature : 260± 5° C

Solder : Sn-Ag3.0-Cu0.5

Preheat : 150° C, 60sec.

Natural

cooling

Isat(A) will cause Lo to drop approximately 20%

cooling

5± 0.5

seconds

245° C

60

seconds

150° C

Preheating

Natural

Dipping

HIGH CURRENT POWER INDUCTORS

Refer to standard electrical characteristics list

Electrical Characteristics Test

Heat Rated Current (Irms)

7. RELIABILITY AND TEST CONDITION :

Inductance

DCR

ITEM

PERFORMANCE

HP4284A

Irms(A) will cause the coil temperature rise

approximately

T=40°C without core loss

HIOKI3540

TEST CONDITION

SSL1308M SERIES