SUPERWORLD ELECTRONICS (S) PTE LTD

NOTE : Specifications subject to change without notice. Please check our website for latest information.

PG. 5

08.04.2011

b) 280° C tip temperature (max)

e) Use a 20 watt soldering iron with tip diameter of 1.0mm

f) Limit soldering time to 3 secs.

d) 1.0mm tip diameter (max)

c) Never contact the ceramic with the iron tip

wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot

by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all

Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused

Recommended temperature profiles for re-flow soldering in Figure 1.

Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that

a soldering iron must be employed the following precautions are recommended.

8-2.1 Solder Re-flow :

air soldering tools.

a) Preheat circuit and products to 150° C.

8-2.2 Soldering Iron (Figure 2) :

Note :

8-1. Recommended PC Board Pattern

H

8. SOLDERING AND MOUNTING :

8-2. Soldering

G

G

2.03± 0.25

G

3.05± 0.25

6.35± 0.25

HI

Unit:m/m

Figure 1. Re-flow Soldering

20~40s max.

Preheating

60~180s

150

Natural

Soldering

cooling

Over 1min.

Figure 2. Iron Soldering

Within 3secs.

Gradual

Cooling

Natural

Preheating Soldering

150

350

300

cooling

200

217

TP(260° C/10s max.)

480s max.

60~150s

TIME(sec.)

HIGH CURRENT POWER INDUCTORS

SSL1005M SERIES

25