8-2. Soldering

8-2.2 Soldering Iron (Figure 2) :

air soldering tools.

8-2.1 Solder Re-flow :

Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused

by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all

wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot

under mechanical stress as warping the board.

the mechanical stress to prevent failure.

Products shall be positioned in the sideway direction against

PC board should be designed so that products are not sufficient

HIGH CURRENT POWER INDUCTORS

8. SOLDERING AND MOUNTING :

8-1. Recommended PC Board Pattern

NOTE : Specifications subject to change without notice. Please check our website for latest information.

7.62± 0.25

7.11± 0.25

3.18± 0.25

300

480s max.

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 5

Gradual

Cooling

Figure 1. Re-flow Soldering

Figure 2. Iron Soldering

TIME(sec.)

25

60~150s

150

60~180s

217

200

Over 1min.

Within 3secs.

150

08.04.2011

Recommended temperature profiles for re-flow soldering in Figure 1.

Natural

Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that

e) Use a 20 watt soldering iron with tip diameter of 1.0mm

Soldering

20~40s max.

TP(260° C/10s max.)

Preheating

cooling

Natural

d) 1.0mm tip diameter (max)

f) Limit soldering time to 3 secs.

Preheating

350

cooling

Soldering

a) Preheat circuit and products to 150° C.

a soldering iron must be employed the following precautions are recommended.

c) Never contact the ceramic with the iron tip

b) 280° C tip temperature (max)

Note :

SSL1308M SERIES

H

G

G

GI

H

Unit:m/m