SUPERWORLD ELECTRONICS (S) PTE LTD

6. RECOMMENDED REFLOW SOLDERING PROFILE :

d) Operating temp. : -40°C to +125°C

c) Storage temp. : -40°C to +125°C

b) Ambient temp. : 100°C Max.

a) Temp. rise : 20°C Max.

WI252018 SERIES

NOTE : Specifications subject to change without notice. Please check our website for latest information.

PG. 2

09.03.2011

e) Terminal strength : 0.5Kg Min.

5. GENERAL SPECIFICATION :

h) Resistance to solvent : Per MIL-STD-202F

g) Resistance to solder heat : 260°C for 10secs

f) Rated current : Current cause inductance drop within 10%

MOLDED WIREWOUND CHIP INDUCTORS

Profile Feature

Preheat & Soak

Temperature min. ( T

)

smin

Temperature max. ( T

)

smax

Time ( T

to T

) ( t )

smin

smax

s

Sn-Pb Eutectic Assembly

100°C

150°C

60~120 seconds

60~120 seconds

200°C

150°C

Pb-Free Assembly

( T

to T )

Average ramp-up rate

p

smax

3°C/second max.

3°C/second max.

Time at liquidous ( t )

Liquidous temperature ( T )

L

183°C

217°C

L

60~150 seconds

60~150 seconds

Peak package body

temperature ( T )

p

230°C

250°C

specified classification

Time ( t ) within 5°C of the

p

10 seconds max

10 seconds max

temperature ( T )

c

Average ramp-down rate

6°C/second max.

6°C/second max.

( T to T

)

smax

p

temperature

Time 25°C to peak

6 minutes max.

8 minutes max.