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PCF8564ACX9-1 数据表(PDF) 34 Page - NXP Semiconductors |
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PCF8564ACX9-1 数据表(HTML) 34 Page - NXP Semiconductors |
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34 / 45 page ![]() PCF8564A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 02 — 30 September 2010 34 of 45 NXP Semiconductors PCF8564A Real time clock and calendar 18. Packing information 18.1 Wafer and Film Frame Carrier (FFC) information Wafer thickness, see Table 34. Fig 30. Wafer layout of PCF8564AU X Saw lane detail X Marking code Straight edge of the wafer 013aaa037 Pin 1 18 μm die type 1 = 84 μm die type 2 = 74 μm die type 1 = 84 μm die type 2 = 74 μm Seal ring plus gap to active circuit ~18 μm 18 μm |
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