PCA9552_5

© Koninklijke Philips Electronics N.V. 2006. All rights reserved.

Product data sheet

Rev. 05 — 9 March 2006

21 of 28

Philips Semiconductors

PCA9552

Fig 24. Package outline SOT355-1 (TSSOP24)

UNIT

(1)

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

7.9

7.7

4.5

4.3

0.65

6.6

6.2

0.4

0.3

8

0

o

o

0.13

0.1

0.2

1

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT355-1

MO-153

99-12-27

03-02-19

0.25

0.5

0.2

Z

e

112

24

13

pin 1 index

θ

A

Q

detail X

L

(A )

3

E

c

X

A

D

y

0

2.5

5 mm

scale

TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm

SOT355-1

A

max.

1.1