PCF8574AP datasheet(2/24 Pages) PHILIPS

2 / 24 page

2002 Nov 22

Philips Semiconductors

Product speciﬁcation

Remote 8-bit I/O expander for I2C-bus

PCF8574

CONTENTS

FEATURES

GENERAL DESCRIPTION

ORDERING INFORMATION

BLOCK DIAGRAM

PINNING

5.1

DIP16 and SO16 packages

5.2

SSOP20 package

CHARACTERISTICS OF THE I2C-BUS

6.1

Bit transfer

6.2

Start and stop conditions

6.3

System configuration

6.4

Acknowledge

FUNCTIONAL DESCRIPTION

7.1

Addressing

7.2

Interrupt output

7.3

Quasi-bidirectional I/Os

LIMITING VALUES

HANDLING

DC CHARACTERISTICS

I2C-BUS TIMING CHARACTERISTICS

PACKAGE OUTLINES

SOLDERING

13.1

Introduction

13.2

Through-hole mount packages

13.2.1

Soldering by dipping or by solder wave

13.2.2

Manual soldering

13.3

Surface mount packages

13.3.1

Reflow soldering

13.3.2

Wave soldering

13.3.3

Manual soldering

13.4

Suitability of IC packages for wave, reflow and

dipping soldering methods

DATA SHEET STATUS

DEFINITIONS

DISCLAIMERS

PURCHASE OF PHILIPS I2C COMPONENTS

PCF8574AP 数据表(PDF) 2 Page - NXP Semiconductors

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