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L6229Q 数据表(PDF) 23 Page - STMicroelectronics |
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L6229Q 数据表(HTML) 23 Page - STMicroelectronics |
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23 / 28 page ![]() L6229Q Application information Doc ID 15209 Rev 3 23/28 Figure 23. Typical application 6.1 Output current capability and ic power dissipation In Figure 24 is shown the approximate relation between the output current and the IC power dissipation using PWM current control. For a given output current the power dissipated by the IC can be easily evaluated, in order to establish which package should be used and how large must be the on-board copper dissipating area to guarantee a safe operating junction temperature (125 °C maximum). Figure 24. IC power dissipation versus output power 1 2 3 4 5 6 7 8 24 23 22 21 20 19 18 17 9 10111213141516 32 31 30 29 28 27 26 25 GND NC H1 H2 H3 H1 H2 H3 NC NC NC NC NC NC Cp D1 D2 Vs 8 ÷ 52 VDC POWER GROUND SIGNAL GROUND + _ M COFF ROFF CPUL RPUL C3 R4 R2 R3 RDD ENABLE CREF1 CREF1 REN R1 CEN VREF Cboot C1 C2 VCP OUT2 VSA GND VSB OUT3 NC VBOOT to SENSEB to EN HALL SENSOR THREE-PHASE MOTOR RH1 RH2 RH3 +5V +5V No PWM f SW = 30 kHz (slow decay) Test Condition s: Supply Voltage = 24 V 0 0.25 0.5 0.75 1 1.25 1.5 0 2 4 6 8 10 P I OUT [A] D [W] IOUT I1 I3 I2 IOUT IOUT |
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