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US2175XG-S08-R 数据表(PDF) 7 Page - Unisonic Technologies

部件名 US2175XG-S08-R
功能描述  DUAL USB HIGH-SIDE POWER SWITCH
PDF  10 Pages
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制造商  UTC [Unisonic Technologies]
网页  http://www.utc-ic.com
标志 UTC - Unisonic Technologies

US2175XG-S08-R 数据表(HTML) 7 Page - Unisonic Technologies

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US2175
CMOS IC
UNISONICTECHNOLOGIESCO.,LTD
7 of 10
www.unisonic.com.tw
QW-R502-403.B
APPLICATION INFORMATION
Fault Flag
The fault flag mainly protects the system from damage caused by such status as thermal shutdown, overcurrent.
Current Limit
The current limit function prevents both excessive in-rush current caused by the plug-in events and the
short-circuit status for MOSFET switches. The current limit threshold is fixed internally, allowing a 1A minimum
current to flow through the MOSFET switches.
Thermal Shutdown
Both thermal shutdown circuits turn both MOSFET switches off if the temperature rises approximately 135°C, at
the same time FLG pin becomes active. 10°C of hysteresis ensures the MOSFETs will not turn on again until the chip
temperature is reduced to 125°C.
Under overcurrent fault conditions, the thermal shutdown will turn off the MOSFET switch which is in this status
due to temperature rise, the other keeps its state.
Supply Filtering
In order to control supply transients, a bypass capacitor placed between IN pin and GND pin is suggested. 0.1μF
to 1μF is suitable. Without a bypass capacitor, an output short may cause sufficient ringing on the input (from supply
lead inductance) to damage internal control circuitry.
Transient Requirements
Ferrite beads are recommended in series with all power and ground connector pins to prevent EMI and
excessive in-rush current generated from input capacitance of down stream during a hot plug-in event. The USB
devices support dynamic attachment (hot plug-in) of peripherals.
.
Short Circuit Transient
A 33μF/16V tantalum or a 100μF/10V electrolytic capacitor located closely to downstream connector for each
port is recommended to provide transient protection and a bulk capacitance provides the short-term transient current
needed during a hot-attachment event.
Printed Circuit Layout
To meet the requirements for power circuitry of USB printed circuit boards, maximum thermal consumption and
minimum voltage drop and EMI is required.



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