MAX9920ASASLASHV+ datasheet(2/18 Pages) MAXIM

2 / 18 page

-20V to +75V Input Range, Precision

Uni-/Bidirectional, Current-Sense Amplifiers

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VCC = 5V, VRS+ = VRS- = +14V, VSENSE = (VRS+ - VRS-) = 0V, VSHDN = VGND = 0V, VREFIN = VCC/2, RL = 100k

Ω; for MAX9918, AV =

90V/V, R2/R1 = 89k

Ω/1kΩ; for MAX9920, AV = 20V/V, R2/R1 = 79kΩ/1kΩ; TA = -40°C to +125°C, unless otherwise noted. Typical val-

ues are at TA = +25°C.) (Note 1)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

VCC to GND ..............................................................-0.3V to +6V

RS+, RS- to GND (VCC = 5V) ..................................-30V to +80V

RS+, RS- to GND (VCC = 0V) .............-15V to +80V (15 minutes)

Differential Input Voltage (VRS+ - VRS-)

(MAX9918/MAX9919).................................±15V (Continuous)

Differential Input Voltage

(VRS+ - VRS-) (MAX9920) .............................±5V (Continuous)

REFIN, FB, OUT to GND.............................-0.3V to (VCC + 0.3V)

SHDN to GND.........................................................-0.3V to +20V

Output Short Circuit to VCC or GND...........................Continuous

Continuous Current into Any Pin

(Not to exceed package power dissipation) ................±20mA

Continuous Power Dissipation (TA = +70°C)

8-Pin SOIC-EP (derate 24.4mW/°C above +70°C) .1951.2mW**

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

PACKAGE THERMAL CHARACTERISTICS (Note 1)

SOIC-EP

Junction-to-Ambient Thermal Resistance (

θJA) ...........41°C/W

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

TA = +25°C

±0.14

±0.4

VRS+ = VRS- =

+14V, VREFIN

= 0V

TA = -40°C

to +125°C

±0.7

TA = +25°C

±0.08

±0.4

MAX9918

VRS+ = VRS- =

-2V, VREFIN =

TA = -40°C

to +125°C

±1.3

TA = +25°C

±0.18

±0.4

VRS+ = VRS- =

+14V, VREFIN

= 0V

TA = -40°C

to +125°C

±0.9

TA = +25°C

±0.11

±0.4

MAX9919_

VRS+ = VRS- =

-2V, VREFIN =

TA = -40°C

to +125°C

±1.0

TA = +25°C

±0.48

±1.2

VRS+ = VRS- =

+14V, VREFIN

= 0V

TA = -40°C

to +125°C

±3.0

TA = +25°C

±0.10

±0.9

Input Offset Voltage (Note 2)

VOS

MAX9920

VRS+ = VRS- =

-2V, VREFIN =

TA = -40°C

to +125°C

±3.5

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

As per JEDEC51 Standard (multilayer board).

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