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HMC772LC4 数据表(PDF) 6 Page - Hittite Microwave Corporation |
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HMC772LC4 数据表(HTML) 6 Page - Hittite Microwave Corporation |
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6 / 18 page ![]() For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 13 - 6 13 Outline Drawing Absolute Maximum Ratings [1] VDD 12V VG2_CONT, VDRAIN -0.5V to VDD + 0.5V SW, EN, CP_OUT, VGATEFB, VNEGFB, TRIG_OUT, DISBL_SC, ISENSE -0.5V to VDIG + 0.5V VDIG 5.5V VNEG -4V to GND VG2 -0.5V to VDD + 0.5V Junction Temperature 125 °C Continuous Pdiss (T = 85 °C) (Derate 19.19 mW/°C above 85 °C) 0.77 Watts ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Thermal Resistance (R TH) (Junction to package bottom) 52.1 °C/W Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C ESD Sensitivity (HBM) Class 1B Note that there are two different voltage domains on HMC981; a high voltage domain Vdd, and a low voltage domain VDIG. Take necessary precautions not to violate ABS MAX ratings of each subdomains. HMC981 v00.0611 ACTIVE BIAS CONTROLLER NOTES: 1. ALL DIMENSIONS IN INCHES [MILLIMETERS] 2. DIE THICKNESS IS 0.010 (0.254) 3. TYPICAL BOND PAD IS 0.0039 SQUARE 4. BOND PAD METALLIZATION: ALUMINUM 5. NO BACKSIDE METAL 6. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS 7. OVERALL DIE SIZE IS ±.002 |
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