ADP151ACBZ-2.75-R7 datasheet(19/24 Pages) AD

19 / 24 page

ADP151

Rev. D | Page 19 of 24

In the case where the board temperature is known, use the

thermal characterization parameter, ΨJB, to estimate the

junction temperature rise (see Figure 57 and Figure 58).

Maximum junction temperature (TJ) is calculated from the

board temperature (TB) and power dissipation (PD) using the

following formula:

TJ = TB + (PD × ΨJB)

(5)

The typical value of ΨJB is 58°C/W for the 4-ball WLCSP package,

43°C/W for the 5-lead TSOT package, and 28.3°C/W for the 6-lead

LFCSP package.

140

120

100

0.3

4.8

4.3

3.8

3.3

2.8

2.3

1.8

1.3

0.8

VIN – VOUT (V)

ILOAD = 1mA

ILOAD = 10mA

ILOAD = 50mA

ILOAD = 100mA

ILOAD = 150mA

ILOAD = 200mA

MAXIMUM JUNCTION TEMPERATURE

Figure 57. WLCSP, TA = 85°C

140

120

100

0.3

4.8

4.3

3.8

3.3

2.8

2.3

1.8

1.3

0.8

VIN – VOUT (V)

ILOAD = 1mA

ILOAD = 10mA

ILOAD = 50mA

ILOAD = 100mA

ILOAD = 150mA

ILOAD = 200mA

MAXIMUM JUNCTION TEMPERATURE

Figure 58. TSOT, TA = 85°C

140

120

100

0.3

5.3

4.3

3.3

2.3

1.3

VIN – VOUT (V)

ILOAD = 1mA

ILOAD = 10mA

ILOAD = 50mA

ILOAD = 100mA

ILOAD = 150mA

ILOAD = 200mA

MAXIMUM JUNCTION TEMPERATURE

Figure 59. LFCSP, TA = 85°C

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