Technical Note

15/17

LM393DR/PWR/DGKR,LM2903DR/PWR/DGKR/VQDR/VQPWR

LM339DR/PWR,LM2901DR/PWR/VQDR/VQPWR

www.rohm.com

2011.06 - Rev.B

© 2011 ROHM Co., Ltd. All rights reserved.

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Derating Curves

0

200

400

600

800

0

25

50

75

100

125

150

AMBIENT TEMPERATURE [℃]

0

200

400

600

800

1000

0

25

50

75

100

125

150

AMBIENT TEMPERATURE [℃]

Power Dissipation

Power Dissipation

Package

Pd[W]

θ

ja [℃/W]

Package

Pd[W]

θ

ja [℃/W]

SOIC8 (*8)

450

3.6

SOIC14

610

4.9

TSSOP8 (*6)

500

4.0

TSSOP14

870

7.0

MSOP8/VSSOP8 (*7)

470

3.76

Fig.91 Derating Curves

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Precautions

1) Unused circuits

When there are unused circuits it is recommended that they be connected as in Fig.92,

setting the non-inverting input terminalto a potential within the in-phase input voltage range (VICR).

2) Input terminal voltage

Applying GND + 36V to the input terminal is possible without causing deterioration of the electrical

characteristics or destruction, irrespective of the supply voltage. However, this does not ensure

normal circuit operation.

Please note that the circuit operates normally only when the input voltage is within the common

mode input voltage range of the electric characteristics.

3) Power supply (single / dual)

The op-amp operates when the specified voltage supplied is between Vcc and GND. Therefore, the single supply op-amp can be used as

a dual supply op-amp as well.

4) Power dissipation Pd

Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise in chip

temperature, including reduced current capability. Therefore, please take into consideration the power dissipation (Pd) under actual

operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating curves for more information.

5) Short-circuit between pins and erroneous mounting

Incorrect mounting may damage the IC. In addition, the presence of foreign particles between the outputs, the output and the power

supply, or the output and GND may result in IC destruction.

6) Terminal short-circuits

When the output and Vcc terminals are shorted, excessive output current may flow, resulting in undue heat generation and, subsequently,

destruction.

7) Operation in a strong electromagnetic field

Operation in a strong electromagnetic field may cause malfunctions.

8) Radiation

This IC is not designed to withstand radiation.

9) IC handing

Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical characteristics due to

piezoelectric (piezo) effects.

10) Board inspection

Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every process is

recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that the power is turned OFF before

inspection and removal. Furthermore, please take measures against ESD in the assembly process as well as during transportation and

storage.

Vcc

－

＋

GND

LM393DR/PWR/DGKR

LM2903DR/PWR/DGKR/VQDR/VQPWR

LM339DR/PWR

LM2901DR/PWR/VQDR/VQPWR

θja = (Tj-Ta)/Pd[℃/W]

Fig.92 Disable circuit example

θja = (Tj-Ta)/Pd[℃/W]

LM393DR

LM2903DR/VQDR

LM393PWR

LM2903PWR/VQPWR

LM393PWR

LM2903PWR/VQPWR

LM339PWR

LM2901PWR/VQPWR

LM339DR

LM2901DR/VQDR