Data

GND

GND

GND

Data

A

B

OE

1.8-V

System

Controller

3.3-V

System

1.8 V

3.3 V

TXB0101

TXB0101

ORDERABLE

TOP-SIDE

PART NUMBER

NanoFree™ – WCSP (DSBGA)

Reel of 3000

27_

0.23-mm Large Bump – YZP (Pb-free)

SOP – DRL

Reel of 4000

27R

Reel of 3000

TXB0101DBVR

NFC_

–40°C to 85°C

SOT (SOT-23) – DBV

Reel of 250

TXB0101DBVT

NFC_

Reel of 3000

27_

SOT (SC-70) – DCK

Reel of 250

27_

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3)

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

(4)

DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.

(5)

Package preview

PIN DESCRIPTION

NO.

NAME

FUNCTION

1

A-port supply voltage. 1.2 V

2

GND

Ground

3

A

4

B

3-state output enable. Pull OE low to place all outputs in 3-state mode.

5

OE

6

B-port supply voltage. 1.65 V

TYPICAL OPERATING CIRCUIT

2

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