SM6TY

Characteristics

Doc ID 17741 Rev 1

7/11

Figure 12.

Relative variation of thermal

impedance, junction to ambient,

versus pulse duration

Figure 13.

Thermal resistance junction to

ambient versus copper surface

under each lead

Zth (j-a)/Rth (j-a)

0.01

0.10

1.00

1.0E-03

1.0E-02

1.0E-01

1.0E+00

1.0E+01

1.0E+02

1.0E+03

Recommended pad layout

Printed circuit board FR4, copper thickness = 35 µm

ms

tp

R

0

10

20

30

40

50

60

70

80

90

100

110

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

Printed circuit board FR4,

copper thickness = 35 µm

Figure 14.

Leakage current versus junction

temperature (typical values)

Figure 15.

Peak forward voltage drop versus

peak forward current

(typical values)

I

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

25

50

75

100

125

150

V

V

V

V

T (° C)

j

1.0E-02

1.0E-01

1.0E+00

1.0E+01

1.0E+02

0.0

0.5

1.0

1.5

2.0

2.5

3.0

I

T

T