2.3GHz to 2.7GHz MIMO Wireless

Broadband RF Transceiver

2

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DC ELECTRICAL CHARACTERISTICS

ENABLE and TXRX set according to operating mode. CS = high, SCLK = DIN = low, no input signal at RF inputs, all RF inputs and

outputs terminated into 50

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

2.7

3.6

V

2µA

Clock-out only mode

2.7

3.8

Standby mode

33

50

One receiver on

79

101

Rx mode

Both receivers on

120

148

16 QAM

116

148

Tx mode

64 QAM (Note 3)

145

183

Rx calibration mode, both receivers on

153

200

Supply Current

Tx calibration mode

102

145

mA

D[9:8] = 00 in A[4:0] = 00100

0.8

1.05

1.35

D[9:8] = 01 in A[4:0] = 00100

1.15

D[9:8] = 10 in A[4:0] = 00100

1.25

Rx I/Q Output Common-Mode

Voltage

D[9:8] = 11 in A[4:0] = 00100

1.45

V

Tx Baseband Input Common-

Mode Voltage Operating Range

DC-coupled

0.5

1.2

V

Tx Baseband Input Bias Current

Source current

10

20

µA

LOGIC INPUTS: TXRX, ENABLE, SCLK, DIN,

CS, B7:B0, CLKOUT_DIV, RXHP

V

0.4

V

-1

+1

µA

ABSOLUTE MAXIMUM RATINGS

RF Inputs: RXINA+, RXINA-, RXINB+,

RXINB- to GND ............................................AC-Coupled Only

RF Outputs: TXOUT+, TXOUT- to GND.................-0.3V to +3.9V

Analog Inputs: TXBBI+, TXBBI-, TXBBQ+,

TXBBQ- to GND.................................................-0.3V to +3.9V

Analog Outputs: RXBBIA+, RXBBIA-, RXBBQA+, RXBBQA-,

RXBBIB+, RXBBIB-, RXBBQB+, RXBBQB-, CPOUT+,

CPOUT-, PABIAS, RSSI to GND........................-0.3V to +3.9V

Digital Inputs: TXRX, CS, SCLK, DIN, B7:B0,

CLKOUT_DIV, RXHP, ENABLE to GND ............-0.3V to +3.9V

Digital Outputs: DOUT, CLKOUT ..........................-0.3V to +3.9V

Bias Voltages: VCOBYP .......................................-0.3V to +3.9V

Short-Circuit Duration on All Output Pins ...............................10s

RF Input Power: All RXIN_ ..............................................+10dBm

RF Output Differential Load VSWR: All TXOUT .......................6:1

73-Bump WLP (derate 31.3mW/°C above +70°C).....2500mW

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +160°C

Soldering Temperature (reflow) .........................(Note 1) +260°C

Note 1: Refer to Application Note 1891:

Understanding the Basics of the Wafer-Level Chip-Scale Package (WL-CSP) available at

CAUTION! ESD SENSITIVE DEVICE