MAX19985A datasheet(2/23 Pages) MAXIM

2 / 23 page

Dual, SiGe, High-Linearity, 700MHz to 1000MHz

Downconversion Mixer with LO Buffer/Switch

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS

(

Typical Application Circuit, VCC = 3.0V to 3.6V, TC = -40°C to +85°C. Typical values are at VCC = 3.3V, TC = +25°C, all parameters

are guaranteed by design and not production tested, unless otherwise noted.)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Note 1: Based on junction temperature TJ = TC + (

θJC x VCC x ICC). This formula can be used when the temperature of the exposed

pad is known while the device is soldered down to a PCB. See the

Applications Information section for details. The junction

temperature must not exceed +150°C.

Note 2: Junction temperature TJ = TA + (

θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is

known. The junction temperature must not exceed +150°C.

Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Note 4: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.

VCC to GND ...........................................................-0.3V to +5.5V

LO1, LO2 to GND ...............................................................±0.3V

Any Other Pins to GND...............................-0.3V to (VCC + 0.3V)

RFMAIN, RFDIV, and LO_ Input Power ..........................+15dBm

RFMAIN, RFDIV Current (RF is DC shorted

to GND through balun)....................................................50mA

Continuous Power Dissipation (Note 1) ..............................8.8W

θJA (Notes 2, 3)..............................................................+38°C/W

θJC (Note 3).....................................................................7.4°C/W

Operating Temperature Range (Note 4) .....TC = -40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

VCC

R2 = R5 = 600

3.0

3.3

3.6

Supply Current

ICC

Total supply current, VCC = 3.3V

280

LOSEL Input High Voltage

VIH

LOSEL Input Low Voltage

VIL

0.8

+5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS

(

Typical Application Circuit, VCC = 4.75V to 5.25V, TC = -40°C to +85°C. Typical values are at VCC = 5.0V, TC = +25°C, all parame-

ters are production tested, unless otherwise noted.)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

VCC

4.75

5.25

Supply Current

ICC

330

380

LOSEL Input High Voltage

VIH

LOSEL Input Low Voltage

VIL

0.8

LOSEL Input Current

IIH, IIL

-10

+10

µA

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