For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824

Phone: 978-250-3343

Fax: 978-250-3373

Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

7

7 - 13

Outline Drawing

Absolute Maximum Ratings

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS]

3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.

4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.

5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.

Drain Bias Voltage (Vdd)

+7 Vdc

RF Input Power (RFIN)(Vdd = +3 Vdc)

0 dBm

Channel Temperature

150 °C

Continuous Pdiss (T = 85 °C)

(derate 6.35 mW/°C above 85 °C)

0.413 W

Thermal Resistance

(channel to lead)

157 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-40 to +85 °C

ESD Sensitivity (HBM)

Class 1A

Part Number

Package Body Material

Lead Finish

MSL Rating

Package Marking

[3]

HMC286

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

H286

XXXX

HMC286E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

286E

XXXX

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

Package Information

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

HMC286 / 286E

v03.0410

GaAs MMIC LOW NOISE

AMPLIFIER, 2.3 - 2.5 GHz