1

1 - 11

For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824

Phone: 978-250-3343

Fax: 978-250-3373

Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

Outline Drawing

Absolute Maximum Ratings

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM]

2. DIE THICKNESS IS .004”

3. TYPICAL BOND IS .004” SQUARE

4. BACKSIDE METALLIZATION: GOLD

5. BOND PAD METALLIZATION: GOLD

6. BACKSIDE METAL IS GROUND.

7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.

Drain Bias Voltage (Vdd)

+5.5 Vdc

RF Input Power (RFIN)(Vdd = +3.0 Vdc)

+3 dBm

Channel Temperature

175 °C

Continuous Pdiss (T = 85 °C)

(derate 3.44 mW/°C above 85 °C)

0.310 W

Thermal Resistance

(channel to die bottom)

290 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-55 to +85 °C

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

Standard

Alternate

GP-2 (Gel Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

HMC341

v01.1007

GaAs MMIC LOW NOISE

AMPLIFIER, 24 - 30 GHz