LM1185SF datasheet(4/4 Pages) HTC

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LM1185SF 数据表(PDF) 4 Page - HTC Korea TAEJIN Technology Co.

部件名	LM1185SF

功能描述	150 mA C-MOS L.D.O. Regulator

PDF	4 Pages

Scroll/Zoom	100%

制造商	HTC [HTC Korea TAEJIN Technology Co.]

网页	http://www.htckorea.co.kr

标志

4 / 4 page

150 mA C-MOS L.D.O. Regulator

LM1185SF

EQUATION 3-1:

HTC

−

4 −

The maximum allowable power dissipation (Equation

3-2) is a function of the maximum ambient

temperature(TAMAX), the maximum allowable die

temperature(TJMAX) and the thermal resistance from

junction-to-air(θJA).

EQUATION 3-2:

3.3 Layout Considerations :

The primary path of heat conduction out of the package is via the package leads. Therefore,layouts

having a ground plane,wide traces at the pads,and wide power supply bus lines combine to lower θ JA

and therefore increase the maximum allow able power dissipation limit.

Equation 3-1 can be used in conjunction with

Equation 4-2 to ensure regulator thermal operation

is within limits.Forexample:

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