数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

385LP4E 数据表(PDF) 3 Page - Hittite Microwave Corporation

部件名 385LP4E
功能描述  MMIC VCO w/ BUFFER AMPLIFIER, 2.25 - 2.5 GHz
PDF  6 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  HITTITE [Hittite Microwave Corporation]
网页  http://www.hittite.com
标志 HITTITE - Hittite Microwave Corporation

385LP4E 数据表(HTML) 3 Page - Hittite Microwave Corporation

  385LP4E Datasheet HTML 1Page - Hittite Microwave Corporation 385LP4E Datasheet HTML 2Page - Hittite Microwave Corporation 385LP4E Datasheet HTML 3Page - Hittite Microwave Corporation 385LP4E Datasheet HTML 4Page - Hittite Microwave Corporation 385LP4E Datasheet HTML 5Page - Hittite Microwave Corporation 385LP4E Datasheet HTML 6Page - Hittite Microwave Corporation  
Zoom Inzoom in Zoom Outzoom out
 3 / 6 page
background image
11
11 - 16
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Absolute Maximum Ratings
Outline Drawing
Vcc
+3.5 Vdc
Vtune
0 to +11V
Channel Temperature
135 °C
Continuous Pdiss (T = 85°C)
(derate 6.28 mW/°C above 85°C)
565 W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
Typical Supply Current vs. Vcc
Note: VCO will operate over full voltage range shown above.
Vcc (V)
Icc (mA)
2.75
28
3.0
35
3.25
41
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Part Number
Package Body Material
Lead Finish
MSL Rating
Package Marking
[3]
HMC385LP4
Low Stress Injection Molded Plastic
Sn/Pb Solder
MSL1
[1]
H385
XXXX
HMC385LP4E
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
MSL1
[2]
H385
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Package Information
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS].
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST
BE SOLERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
PCB LAND PATTERN
MMIC VCO w/ BUFFER
AMPLIFIER, 2.25 - 2.5 GHz
v02.0705
HMC385LP4 / 385LP4E



Html Pages

1 2 3 4 5 6


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com