For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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Typical Supply Current vs. Vdd

Vdd (V)

Idd (mA)

+2.4

9

+2.7

12

+3.0

16

+4.5

33

+5.0

39

+5.5

44

Drain Bias Voltage (Vdd)

+8 V

RF Input Power (RFIN)

(Vdd = +5.0 Vdc)

LNA Mode

Bypass Mode

+15 dBm

+30 dBm

Channel Temperature

150 °C

Continuous Pdiss (T = 85 °C)

(derate 13 mW/°C above 85 °C)

850 mW

Thermal Resistance

(channel to ground paddle)

76.9 °C/W

Storage Temperature

-65 to +150° C

Operating Temperature

-40 to +85° C

ESD Sensitivity (HBM)

Class 1A

Absolute Maximum Ratings

HMC593LP3 / 593LP3E

v03.0309

GaAs PHEMT MMIC LOW NOISE

AMPLIFIER w/ BYPASS MODE, 3.3 - 3.8 GHz

Bypass Mode, Psat vs. Temperature

-5

-4

-3

-2

-1

0

3.3

3.4

3.5

3.6

3.7

3.8

+25C

+85C

-40C

FREQUENCY (GHz)

Outline Drawing

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS]

3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE

4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.

PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.

5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.

6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.

7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.

Part Number

Package Body Material

Lead Finish

MSL Rating

Package Marking

[3]

HMC593LP3

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

593

XXXX

HMC593LP3E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

593

XXXX

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

Package Information