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Document Number: 72505

S11-0303-Rev. D, 28-Feb-11

Vishay Siliconix

DG3001, DG3002, DG3003

Notes:

a. Signals on NC, NO, or COM or IN exceeding V+ will be clamped by internal diodes. Limit forward diode current to maximum current ratings.

b. Refer to IPC/JEDEC (J-STD-020A)

c. All bumps soldered to PC board.

d. Derate 3.1 mW/°C above 70 °C.

ORDERING INFORMATION

Temp. Range

Package

Part Number

- 40 °C to 85 °C

MICRO FOOT: 6/-Bump 3 x 2, 0.5-mm pitch, 165 µm nom. bump height

(Eutectic, SnPb)

DG3001DB-T1

DG3002DB-T1

DG3003DB-T1

MICRO FOOT: 6-Bump 3 x 2, 0.5-mm pitch,

238 µm nom. bump height (Lead (Pb)-free, Sn/Ag/Cu)

DG3001DB-T1-E1

DG3002DB-T1-E1

DG3003DB-T1-E1

Parameter

Limit

Unit

Reference V+ to GND

- 0.3 to + 6

V

- 0.3 to (V+ + 0.3 V)

Continuous Current (NO, NC, COM)

± 250

mA

Peak Current (Pulsed at 1 ms, 10 % duty cycle)

± 400

Storage Temperature

(D Suffix)

- 65 to 150

°C

VPR (Eutectic)

215

IR/Convection

(Eutectic)

220

(Lead (Pb)-free)

250

250

mW