HI-8192PCI datasheet(8/9 Pages) HOLTIC

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HI-8190 PACKAGE DIMENSIONS

16-PIN PLASTIC CHIP-SCALE PACKAGE

millimeters

Package Type: 16PCS1

BSC = “Basic Spacing between Centers”

is theoretical true position dimension and

has no tolerance. (JEDEC Standard 95)

Top View

Bottom

View

Electrically isolated metal

heat sink on bottom of

package

Connect to any ground or

power plane for optimum

thermal dissipation

16-PIN PLASTIC SMALL OUTLINE (SOIC) - NB

(Narrow Body)

inches (millimeters)

Package Type: 16HN

BSC = “Basic Spacing between Centers”

is theoretical true position dimension and

has no tolerance. (JEDEC Standard 95)

° to 8°

Detail A

.0069 ± .0029

(.176 ± .074)

.033 ± .017

(.838 ± .432)

.061 ± .007

(1.549 ± .178)

.0165 ± .003

(.419 ± .089)

.390 ± .004

(9.90 ± .10)

.236

±.008

(5.99

±.20)

.0087 ± .0012

(.220 ± .029)

See Detail A

.1525 ± .0025

(3.87 ± .06)

Top View

.050

(1.27)

BSC

5.00 ± 0.05

(0.197 ± 0.002)

3.38 ± 0.05

(0.133 ± 0.002)

0.75 ± 0.05

(0.03 ± 0.002)

0.025 ± 0.025

(0.001 ± 0.001)

0.203

(0.008)

REF.

0.80

(0.031) BSC

0.30

0.012

± 0.05

(

± 0.002)

.50 ± 0.05

(0.020 ± 0.002)

0.20

(0.008)

min.

HOLT INTEGRATED CIRCUITS

HI-8192PCI 数据表(PDF) 8 Page - Holt Integrated Circuits

HI-8192PCI 数据表(HTML) 8 Page - Holt Integrated Circuits

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