LIS302DL datasheet(40/42 Pages) STMICROELECTRONICS

40 / 42 page

Package information

LIS302DL

40/42

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 26.

LGA 14: mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

0.920

1.000

0.0362 0.0394

0.700

0.0275

0.180

0.220

0.260 0.0071 0.0087 0.0102

2.850

3.000

3.150 0.1122 0.1181 0.1240

4.850

5.000

5.150 0.1909 0.1968 0.2027

0.800

0.0315

0.300

0.0118

4.000

0.1575

1.360

0.0535

1.200

0.0472

0.965

0.975

0.985 0.0380 0.0384 0.0386

0.640

0.650

0.660 0.0252 0.0256 0.0260

0.750

0.800

0.850 0.0295 0.0315 0.0335

0.450

0.500

0.550 0.0177 0.0197 0.0217

1.200

1.600 0.0472

0.0630

0.150

0.0059

0.050

0.0020

0.100

0.0039

0.100

0.0039

LGA14 (3x5x0.92mm) Pitch 0.8mm

Land Grid Array Package

7773587 C

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