SP3003 datasheet(3/6 Pages) LITTELFUSE

3 / 6 page

Speciﬁcations are subject to change without notice.

Please refer to

www.littelfuse.com/SPA for current information.

TVS Diode Arrays (SPA™Family of Products)

Revision: April 14, 2011

SP3003 Series

Low Capacitance ESD Protection - SP3003 Series

Capacitance vs. Frequency

2E-13

4E-13

6E-13

8E-13

1E-12

1.2E-12

1.4E-12

1.E+06

1.E+07

1.E+08

1.E+09

Frequency [Hz]

Product Characteristics

Lead Plating

Matte Tin (SC70-x, MSOP-10) Pre-Plated

Frame (SOT5x3)

Lead Material

Copper Alloy

Lead Coplanarity

0.0004 inches (0.102mm)

Subsitute Material

Silicon

Body Material

Molded Epoxy

Flammability

UL94-V-0

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold ﬂash & metal burr.

4. All speciﬁcations comply to JEDEC SPEC MO-223 Issue A

5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

6. Package surface matte ﬁnish VDI 11-13.

Time

TS(max)

TS(min)

time to peak temperature

Preheat

Ramp-up

Ramp-down

Ramp-do

Critical Zone

TL to TP

Critical Zone

TL to TP

Reﬂow Condition

Pb – Free assembly

Pre Heat

- Temperature Min (T

s(min))

150°C

- Temperature Max (T

s(max))

200°C

- Time (min to max) (t

60 – 180 secs

Average ramp up rate (Liquidus) Temp

L) to peak

3°C/second max

S(max) to TL - Ramp-up Rate

3°C/second max

Reﬂow

- Temperature (T

L) (Liquidus)

217°C

- Temperature (t

60 – 150 seconds

Peak Temperature (T

250+0/-5 °C

Time within 5°C of actual peak

Temperature (t

20 – 40 seconds

Ramp-down Rate

6°C/second max

Time 25°C to peak Temperature (T

8 minutes Max.

Do not exceed

260°C

Soldering Parameters

SP3003 数据表(PDF) 3 Page - Littelfuse

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