Document Number: 95222

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Revision: 08-Mar-11

1

TO-220AB

Outline Dimensions

Vishay Semiconductors

DIMENSIONS in millimeters and inches

Notes

shall not exceed 0.127 mm (0.005") per side. These dimensions

are measured at the outermost extremes of the plastic body

E1

singulation irregularities are allowed

D2 (minimum) where dimensions are derived from the actual

package outline

SYMBOL

MILLIMETERS

INCHES

NOTES

SYMBOL

MILLIMETERS

INCHES

NOTES

MIN.

MAX.

MIN.

MAX.

MIN.

MAX.

MIN.

MAX.

A

4.25

4.65

0.167

0.183

E

10.11

10.51

0.398

0.414

3, 6

A1

1.14

1.40

0.045

0.055

E1

6.86

8.89

0.270

0.350

6

A2

2.56

2.92

0.101

0.115

E2

-

0.76

-

0.030

7

b

0.69

1.01

0.027

0.040

e

2.41

2.67

0.095

0.105

b1

0.38

0.97

0.015

0.038

4

e1

4.88

5.28

0.192

0.208

b2

1.20

1.73

0.047

0.068

H1

6.09

6.48

0.240

0.255

6, 7

b3

1.14

1.73

0.045

0.068

4

L

13.52

14.02

0.532

0.552

c

0.36

0.61

0.014

0.024

L1

3.32

3.82

0.131

0.150

2

c1

0.36

0.56

0.014

0.022

4

Ø P

3.54

3.73

0.139

0.147

D

14.85

15.25

0.585

0.600

3

Q

2.60

3.00

0.102

0.118

D1

8.38

9.02

0.330

0.355



90° to 93°

90° to 93°

D2

11.68

12.88

0.460

0.507

6

13

2

D

D1

H1

Q

13

2

C

C

D

D

3 x b2

3 x b

(b, b2)

b1, b3

(H1)

D2

Detail B

C

A

B

L

e1

Lead tip

E

E2

Ø P

0.014

A

B

M

M

0.015

A

B

MM

Seating

plane

c

A2

A1

A

A

A

Lead assignments

Diodes

1. - Anode/open

2. - Cathode

3. - Anode

Conforms to JEDEC outline TO-220AB

(6)

(6)

(7)

(6)

(7)

e

2 x

L1 (2)

Detail B

Section C - C and D - D

View A - A

Base metal

Plating

(4)

(4)

c1

c

(6)

Thermal pad

(E)

E1

(6)