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ES3 数据表(PDF) 2 Page - Japan Aviation Electronics Industry, Ltd. |
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ES3 数据表(HTML) 2 Page - Japan Aviation Electronics Industry, Ltd. |
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2 / 5 page ![]() MB-0221-1 2/5 JAE PMK Div. Proprietary. Copyright © 2010, Japan Aviation Electronics Industry, Ltd. Materials and Finishes Ordering Information Copper alloy / Sn plating Contact-L Copper alloy / Sn plating Contact-R White LCP Insulator Material / Finish Component ES3 B 002 W F 1 R**** Series No. of Contacts Modification Code Reel Product (Note1) Connection Area Plating F: Sn plating Features No. of Contacts: 2 pos. Contact Resistance: 60mΩ max. (initial) Dielectric Withstanding Voltage: AC 500Vr.m.s (per minute) Durability: 20 mating cycles Board Insertion Force: 30N max. Rated Current: 1A Rated Voltage: AC, DC 200V Insulation Resistance: 10MΩ min. (after test) Operating Temperature: -40 to+105 Deg. C Low-profile 1.6mm mounting height, designed with consideration for light shielding. Insulator is made of white LCP for heat and light resistance. Direct connection of converter board and LED mounting board allows for reduced assembly work time. Cable-less connection makes reduction in the number of parts possible. SMT type, can be mounted at the same time as other components to the LED mounting board. General Specifications Connection B: Bottom Mount Type Connection to Board W: SMT straight type, without hold-down |
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