AD7607 datasheet(11/36 Pages) AD

11 / 36 page

Data Sheet

AD7609

Rev. A | Page 11 of 36

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 4.

Parameter

Rating

AVCC to AGND

−0.3 V to +7 V

VDRIVE to AGND

−0.3 V to AVCC + 0.3 V

Analog Input Voltage to AGND1

±16.5 V

Digital Input Voltage to AGND

−0.3 V to VDRIVE + 0.3 V

Digital Output Voltage to AGND

−0.3 V to VDRIVE + 0.3 V

REFIN to AGND

−0.3 V to AVCC + 0.3 V

Input Current to Any Pin Except

Supplies1

±10 mA

Operating Temperature Range

B Version

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature

150°C

Pb/SN Temperature, Soldering

Reflow (10 sec to 30 sec)

240(+0)°C

Pb-Free Temperature, Soldering Reflow

260(+0)°C

ESD (All Pins Except Analog Inputs)

2 kV

ESD (Analog Input Pins Only)

7 kV

Transient currents of up to 100 mA do not cause SCR latch-up.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages. These

specifications apply to a 4-layer board.

Table 5. Thermal Resistance

Package Type

θJA

θJC

Unit

64-Lead LQFP

°C/W

ESD CAUTION

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