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PCF2111CP 数据表(PDF) 2 Page - NXP Semiconductors |
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PCF2111CP 数据表(HTML) 2 Page - NXP Semiconductors |
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2 / 24 page ![]() 1997 Mar 28 2 Philips Semiconductors Product specification LCD drivers PCF21xxC family CONTENTS 1 FEATURES 2 GENERAL DESCRIPTION 3 QUICK REFERENCE DATA 4 ORDERING INFORMATION 5 BLOCK DIAGRAMS 6 PINNING 6.1 PCF2100C 6.2 PCF2111C 6.3 PCF2112C 7 FUNCTIONAL DESCRIPTION 7.1 PCF2100C 7.2 PCF2111C 7.3 PCF2112C 7.4 Bus control logic 7.5 Timing 7.6 Input circuitry 7.7 Expansion 8 LIMITING VALUES 9 HANDLING 10 DC CHARACTERISTICS 11 AC CHARACTERISTICS 12 PACKAGE OUTLINES 13 SOLDERING 13.1 Plastic dual in-line packages 13.1.1 By dip or wave 13.1.2 Repairing soldered joints 13.2 Plastic small outline packages 13.2.1 By wave 13.2.2 By solder paste reflow 13.2.3 Repairing soldered joints (by hand-held soldering iron or pulse-heated solder tool) 14 DEFINITIONS 15 LIFE SUPPORT APPLICATIONS |
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