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PCF2123BS 数据表(PDF) 2 Page - NXP Semiconductors

部件名 PCF2123BS
功能描述  Save power with small, ultra-efficient RTCs
PDF  2 Pages
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制造商  PHILIPS [NXP Semiconductors]
网页  http://www.nxp.com
标志 PHILIPS - NXP Semiconductors

PCF2123BS 数据表(HTML) 2 Page - NXP Semiconductors

  PCF2123BS Datasheet HTML 1Page - NXP Semiconductors PCF2123BS Datasheet HTML 2Page - NXP Semiconductors  
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Characteristics
PCF8523
PCF2123
PCF85(1)63
PCA21125
PCA8565
Interface
I2C
SPI
I2C
SPI
I2C
Temperature range
-40º to +85 °C
-40º to +85 ºC
-40 to +85 °C
-40 to +125 °C
-40 to +125 °C
Supply voltage V
DD clock
1.2 to 5.5 V
1.1 V to 5.5 V
1.0 to 5.5 V
1.3 to 5.5 V
1.0 to 5.5 V
Supply voltage V
DD interface
1.6 to 5.5 V
1.6 V to 5.5 V
1.8 to 5.5 V
1.6 to 5.5 V
1.8 to 5.5 V
Supply current at V
DD = 2 V
100 nA
100 nA
270 nA
640 nA
600 nA
Electronic tuning
yes
yes
no
no
no
Type
Package tape and reel
Type
Version
PCF8523T/1
SO8, plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
1
PCF8523TS/1
TSSOP14, plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
1
PCF8523TK/1
HVSON8, plastic thermal enhanced very thin small outline package; no leads; 8 terminals; 4 x
4 x 0.85 mm
SOT909-1
1
PCF2123TS/1
TSSOP14, plastic thin shrink small outline package, 14 leads; body width 4.4 mm
SOT402-1
1
PCF2123BS/1
HVQFN16, plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body
3 x 3 x 0.85 mm
SOT758-1
1
PCF2123U/10AA/1
Bare die, die thickness 200 µm
-
1
PCF2123U/12AA/1
Bare die with gold bumps, die thickness 200 µm
-
1
PCF2123U/12HA/1
Bare die with gold bumps, die thickness 150 µm
-
1
PCF8523U/12AA/1
Bare die with gold bumps, die thickness 200 µm
-
1
PCF8523 block diagram
PCF2123 block diagram
Selection guide
Ordering Information
The calendar functions track year, month, weekday, and day
with built-in Leap Year correction. The programmable alarm and
timer function gives the option of generating a wake-up signal
on an interrupt pin.
In the PCF2123, the Watchdog timer can be used to wake
a microcontroller from hibernation mode or monitor
microcontroller tasks independently.
www.nxp.com
Date of release: March 2011
Document order number : 9397 750 17076
Printed in the Netherlands
© 2011 NXP Semiconductors N.V.
All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable
and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.



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