MAX7370 datasheet(2/37 Pages) MAXIM

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MAX7370

8 x 8 Key-Switch Controller and LED Driver/GPIOs

with I2C Interface and High Level of ESD Protection

VCC, VLA to GND ....................................................-0.3V to +4V

COL3–COL0, ROW7–ROW0 to GND ....... -0.3V to (VCC + 0.3V)

COL7–COL4 to GND...............................................-0.3V to +6V

SDA, SCL, AD0, INT to GND ..................................-0.3V to +6V

VLA to VCC ...........................................................-0.3V to +2.3V

DC Current on COL7–COL4 to GND .................................25mA

DC Current on COL3–COL0, ROW7–ROW0 to GND...........7mA

VCC, VLA, GND Current .....................................................80mA

DC Current VCC, VLA to COL3–COL0, ROW7–ROW0.........5mA

Continuous Power Dissipation (TA = +70°C)

24-Pin TQFN (derate 15.4mW/°C above +70°C) ......1229mW

25-Bump WLP (derate 19.2mW/°C above +70°C)......850mW

Operating Temperature Range.......................... -40°C to +85°C

Junction Temperature .....................................................+150°C

Storage Temperature Range............................ -65°C to +150°C

Lead Temperature (TQFN) (soldering, 10s) ...................+300°C

Soldering Temperature (reflow) ......................................+260°C

24 TQFN

Junction-to-Ambient Thermal Resistance (BJA).........65.1°C/W

Junction-to-Case Thermal Resistance (BJC)................5.4°C/W

25 WLP

Junction-to-Ambient Thermal Resistance (BJA)...........52°C/W

ABSOLUTE MAXIMUM RATINGS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

ELECTRICAL CHARACTERISTICS

(VCC = 1.62V to 3.6V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at VCC = 3.3V, TA = +25NC.) (Notes 2, 3)

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Operating Supply Voltage

VCC

1.62

3.3

3.6

Second Logic Supply

VLA

VCC

3.3

3.6

Operating Supply Current

ICC

All key switches open, oscillator

running

N keys pressed

50 + 28 O N

Sleep-Mode Supply Current

ISL

Not using GPO or LED configuration

1.8

POR Threshold

VPOR

1.2

KEY-SWITCH SPECIFICATIONS

Key-Switch Source Current

IKEY

Key-Switch Source Voltage

VKEY

0.45

0.5

Key-Switch Resistance

RKEY

(Note 4)

Startup Time from Sleep

tSTART

2.7

GPIO SPECIFICATIONS

External Supply Voltage

COL7–COL4 (LED Drivers)

VLED

LED Port-to-Port Sink Current Variation

VCC = 3.3V, VOL = 1V, TA = +25NC,

10mA output mode

1.5

2.4

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