IX2127 datasheet(11/12 Pages) CLARE

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IX2127

R02

www.clare.com

3.5 Mechanical Dimensions

3.5.1 8-Pin DIP Through-Hole Package

3.5.2 8-Pin SOIC Package

Dimensions

(inches)

PCB Hole Pattern

2.540 ± 0.127

(0.100 ± 0.005)

6.350 ± 0.127

(0.250 ± 0.005)

9.144 ± 0.508

(0.360 ± 0.020)

0.457 ± 0.076

(0.018 ± 0.003)

9.652 ± 0.381

(0.380 ± 0.015)

7.239 TYP.

(0.285)

7.620 ± 0.254

(0.300 ± 0.010)

4.064 TYP

(0.160)

0.889 ± 0.102

(0.035 ± 0.004)

8-0.800 DIA.

(8-0.031 DIA.)

2.540 ± 0.127

(0.100 ± 0.005)

7.620 ± 0.127

(0.300 ± 0.005)

7.620 ± 0.127

(0.300 ± 0.005)

6.350 ± 0.127

(0.250 ± 0.005)

3.302 ± 0.051

(0.130 ± 0.002)

0.254 TYP

(0.01)

Dimensions

mm MIN / mm MAX

(inches MIN / inches MAX)

5.8014 / 6.1976

(0.2284 / 0.2440)

0.356 / 0.457

(0.014 / 0.018)

1.27 TYP

(0.05 TYP)

3.810 / 3.988

(0.150 / 0.157)

4.801 / 4.978

(0.189 / 0.196)

0.533 REF

(0.021 REF)

1.524 / 1.727

(0.060 / 0.068)

0.1016 / 0.2489

(0.0040 / 0.0098)

0.406 / 1.270

(0.016 / 0.050)

0.1905 / 0.2489

(0.0075 / 0.0098)

1.372 / 1.575

(0.054 / 0.062)

PCB Land Pattern

1.27

(0.050)

0.60

(0.024)

1.50

(0.059)

5.30

(0.209)

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