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ADA4830-1BCPZ-R2 数据表(PDF) 15 Page - Analog Devices |
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ADA4830-1BCPZ-R2 数据表(HTML) 15 Page - Analog Devices |
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15 / 22 page ![]() Data Sheet ADA4830-1/ADA4830-2 Rev. C | Page 15 of 22 INPUT COMMON-MODE RANGE In a standard four resistor difference amplifier with 0.50 V/V gain, the input common-mode (CM) range is three times the CM range of the core amplifier. In the ADA4830-1 and ADA4830-2, however, the input CM range has been extended to more than 18 V (with a 5 V supply). The input CM range can be approximated by using the following formulas: For the maximum CM voltage, 5(+VS − 1.25) − 4VREF ≈ VINCM(MAX) ≤ 9.5 V For the minimum CM voltage, −10 V ≤ VINCM(MIN) ≈ − (1 + 4VREF) Approximate minimum and maximum CM voltages are shown in Table 7 for several common supply voltages. Table 7. Input Common-Mode Range Examples +VS (V) VREF (V) VINCM(MIN) (V) VINCM(MAX) (V) 3.0 1.51 –7.0 2.8 3.0 0.97 –4.9 4.9 3.3 1.651 –7.6 3.6 3.3 1.15 –5.6 5.6 3.6 1.81 –8.2 4.5 3.6 1.34 –6.4 6.4 5.0 2.51 –10 8.7 5.0 2.22 –9.9 9.5 1 Floating (default condition). –15 –10 –5 0 5 10 15 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 SUPPLY VOLTAGE (V) VINCM (MAX) VINCM (MIN) VREF PIN FLOATING Figure 33. Input Common-Mode Range vs. Supply Voltage SHORT-TO-BATTERY OUTPUT FLAG PIN The flag output (STB) is an active low, open-drain logic configuration. A low level on this output indicates that an overvoltage event has been detected on either the positive or the negative input or both. Flags from multiple chips can be wire-OR'ed to form a single fault detection signal. The output is driven by a grounded source NMOS device, capable of sinking approximately 10 mA while pulling within a few hundred millivolts above ground. The output high level is set with an external pull-up resistor connected to the supply voltage of the logic family that is used to monitor the state of the flag. In the falling direction, the speed with which the flag output responds primarily depends on the external capacitance attached to this node and the sink current that can be provided. For example, if the load is 10 pF, and the external pull-up voltage is 3.3 V, the fall time is a few nanoseconds. In the rising direction, the speed is determined by external capacitance and the magnitude of the pull-up resistor. For the case of 10 pF of external capacitance and a pull-up of 5 kΩ, the time constant of the rising edge is approximately 50 ns. Table 8. STB Pin Function STB Pin Output Device State High (Logic 1) Normal operation Low (Logic 0) STB fault condition ENABLE/DISABLE MODES (ENA PIN) The power-down, or enable/disable (ENA) pin, is internally pulled up to +VS through a 250 kΩ resistor. When the voltage on this pin is high, the amplifier is enabled; pulling ENA low disables the channel. With no external connection, this pin floats high, enabling the amplifier channel. Table 9. ENA Pin Function ENA Pin Input Device State High (Logic 1) Enabled Low (Logic 0) Disabled High-Z (Floating) Normal operation PCB LAYOUT As with all high speed applications, attention to PCB layout is of paramount importance. Adhere to standard high speed layout practices in designs using the ADA4830-1 and ADA4830-2. A solid ground plane is recommended, and placing a 0.1 µF surface- mount, ceramic power supply, decoupling capacitor as close as possible to the supply pin(s) is recommended. Connect the GND pin(s) to the ground plane with a trace that is as short as possible. In cases where the ADA4830-1 and ADA4830-2 drive transmission lines, series terminate the outputs and use controlled impedance traces of the shortest length possible to connect to the signal I/O pins, which should not pass over any voids in the ground plane. EXPOSED PADDLE (EPAD) CONNECTION The ADA4830-1 and ADA4830-2 have an exposed thermal pad (EPAD) on the bottom of the package. This pad is not electrically connected to the die and can be left floating or connected to the ground plane. Should heat dissipation be a concern, thermal resistance can be minimized by soldering the EPAD to a metalized pad on the PCB. Connect this pad to the ground plane with multiple vias. Note that the thermal resistance (θJA) of the device is specified with the EPAD soldered to the PCB. |
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