ADA4830-1/ADA4830-2

Data Sheet

Rev. C | Page 6 of 22

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage (+VS Pin)

6 V

Supply Voltage Delta

+VS1 to +VS2, ADA4830-2 Only

0.5 V

Input Voltage Positive Direction (INNx, INPx)

22 V

Input Voltage Negative Direction (INNx, INPx)

−10 V

Reference Voltage (VREFx Pin)

Power Dissipation

See Figure 3

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +125°C

Lead Temperature (Soldering, 10 sec)

260°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

to a high thermal conductivity, 4-layer (2s2p) circuit board, as

described in EIA/JESD 51-7.

Table 4.

Package Type

Unit

8-Lead LFCSP

50

5

°C/W

16-Lead LFCSP

54

6

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation in the ADA4830-1 and

ADA4830-2 packages is limited by the associated rise in

which is the glass transition temperature, the plastic changes its

properties. Exceeding a junction temperature of 150°C for an

extended time can result in changes in the silicon devices,

potentially causing failure.

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

The power dissipated due to load drive depends on the particular

application. The power due to load drive is calculated by

multiplying the load current by the associated voltage drop

across the device. RMS voltages and currents must be used

in these calculations.

Figure 3 shows the maximum power dissipation in the package vs.

the ambient temperature for the 8-lead LFCSP (116°C/W) and

the 16-lead LFCSP (54°C/W) on a JEDEC standard 4-layer board.

0

0.5

1.0

1.5

2.0

2.5

3.0

0

10

20

30

40

50

60

70

80

90

100

AMBIENT TEMPERATURE (°C)

16-LEAD LFCSP

8-LEAD LFCSP

Figure 3. Maximum Power Dissipation vs.

Ambient Temperature for a 4-Layer Board

ESD CAUTION