ADL5605

Rev. 0 | Page 18 of 20

OUTLINE DIMENSIONS

16

5

13

8

9

12

1

4

1.95 BSC

PIN 1

INDICATOR

TOP

VIEW

4.00

BSC SQ

3.75

BSC SQ

COPLANARITY

0.08

EXPOSED

PAD

(BOTTOM VIEW)

COMPLIANT TO JEDEC STANDARDS MO-220-VGGC

12° MAX

1.00

0.85

0.80

SEATING

PLANE

0.35

0.30

0.25

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

0.20 REF

0.65 BSC

0.60 MAX

0.60 MAX

PIN 1

INDICATOR

0.50

0.40

0.30

0.25 MIN

2.50

2.35 SQ

2.20

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 39. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4 mm Body, Very Thin Quad

(CP-16-10)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADL5605ACPZ-R7

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-16-10

ADL5605-EVALZ

Evaluation Board