ADL5606

Rev. 0 | Page 15 of 20

ACPR AND EVM

All adjacent channel power ratio (ACPR) and error vector

magnitude (EVM) measurements were made using a single

W-CDMA carrier and Test Model 1-64.

The signal is generated by a very low ACPR source and is meas-

ured at the output by a high dynamic range spectrum analyzer.

For ACPR measurements, the filter setting was chosen for low

ACPR; for EVM measurements, the low EVM setting was selected.

The spectrum analyzer incorporates an instrument noise correc-

tion function, and highly linear amplifiers were used to boost

the power levels for ACPR measurements.

For power levels up to 18 dBm, an ACPR of 50 dBc or better

can be achieved at 1960 MHz and 2140 MHz.

The EVM measured is 0.5% for power levels up to 18 dBm at

1960 MHz and 2140 MHz. The baseline composite EVM for

the signal source was approximately 0.5%. When operated in

the linear region, there is little or no contribution to EVM by

the amplifier.

THERMAL CONSIDERATIONS

The ADL5606 is packaged in a thermally efficient 4 mm ×

4 mm, 16-lead LFCSP. The thermal resistance from junction

was extracted assuming a standard 4-layer JEDEC board with

25 copper plated thermal vias. The thermal vias are filled with

conductive copper paste (AE3030 with thermal conductivity of

is 12.9°C/W, where the case is the exposed pad of the lead frame

package.

For the best thermal performance, it is recommended that as

many thermal vias as possible be added under the exposed pad

of the LFCSP. The thermal resistance values assume a minimum

of 25 thermal vias arranged in a 5 × 5 array with a via diameter

of 8 mils, via pad of 16 mils, and a pitch of 20 mils. The vias are

plated with copper, and the drill hole is filled with a conductive

copper paste.

For optimal performance, it is recommended that the thermal

vias be filled with a conductive paste of the equivalent thermal

conductivity specified earlier in this section; alternatively, an

external heat sink can be used to dissipate heat quickly without

affecting the die junction temperature. It is also recommended

that the ground pattern be extended above and below the device

to improve thermal efficiency (see Figure 35).

SOLDERING INFORMATION AND RECOMMENDED

PCB LAND PATTERN

Figure 35 shows the recommended land pattern for the ADL5606.

To minimize thermal impedance, the exposed paddle on the

4 mm × 4 mm LFCSP is soldered to a ground plane along with

Pin 5 to Pin 8 and Pin 13 to Pin 16. To improve thermal dissi-

pation, 25 thermal vias are arranged in a 5 × 5 array under the

exposed paddle. Areas above and below the paddle are tied with

regular vias. If multiple ground layers exist, they should be tied

together using vias. For more information about land pattern

design and layout, see the AN-772 Application Note, A Design

and Manufacturing Guide for the Lead Frame Chip Scale Package

(LFCSP).

RFOUT

RFIN

16 MIL VIA PAD

WITH 8 MIL VIA

16

13

58

Figure 35. Recommended Land Pattern