ADP198ACBZ-R7 datasheet(5/16 Pages) AD

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Data Sheet

ADP198

Rev. D | Page 5 of 16

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VIN to GND Pins

−0.3 V to +7 V

VOUT to GND Pins

−0.3 V to +7 V

EN to GND Pins

−0.3 V to +7 V

Continuous Drain Current

TA = 25°C

±1000 mA

TA = 85°C

±1000 mA

Storage Temperature Range

−65°C to +150°C

Operating Junction Temperature Range

−40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in

combination. The ADP198 can be damaged if the junction

temperature limits are exceeded. Monitoring ambient temperature

does not guarantee that TJ is within the specified temperature

limits. In applications with high power dissipation and poor

thermal resistance, the maximum ambient temperature may

need to be derated.

In applications with moderate power dissipation and low

printed circuit board (PCB) thermal resistance, the maximum

ambient temperature can exceed the maximum limit as long

as the junction temperature is within specification limits. The

junction temperature (TJ) of the device is dependent on the

ambient temperature (TA), the power dissipation of the device

(PD), and the junction-to-ambient thermal resistance of the

package (θJA).

Maximum junction temperature (TJ) is calculated from the

ambient temperature (TA) and power dissipation (PD) using the

formula

TJ = TA + (PD × θJA)

The junction-to-ambient thermal resistance (θJA) of the package

is based on modeling and calculation using a 4-layer board. The

junction-to-ambient thermal resistance is highly dependent on

the application and board layout. In applications where high

maximum power dissipation exists, close attention to thermal

board design is required. The value of θJA may vary, depending on

PCB material, layout, and environmental conditions. The speci-

fied values of θJA are based on a 4-layer, 4 inch × 3 inch PCB. Refer

to JESD 51-7 and JESD 51-9 for detailed information regarding

board construction. For additional information, see the AN-617

Application Note, MicroCSP™ Wafer Level Chip Scale Package.

ΨJB is the junction-to-board thermal characterization parameter

with units of °C/W. The ΨJB of the package is based on modeling

and calculation using a 4-layer board. The JESD51-12, Guidelines

for Reporting and Using Package Thermal Information, states that

thermal characterization parameters are not the same as thermal

resistances. ΨJB measures the component power flowing through

multiple thermal paths rather than a single path as in thermal

resistance, θJB. Therefore, ΨJB thermal paths include convection

from the top of the package as well as radiation from the package,

factors that make ΨJB more useful in real-world applications.

Maximum junction temperature (TJ) is calculated from the

board temperature (TB) and power dissipation (PD) using the

formula

TJ = TB + (PD × ΨJB)

Refer to JESD51-8, JESD51-9, and JESD51-12 for more detailed

information about ΨJB.

THERMAL RESISTANCE

θJA and ΨJB are specified for the worst-case conditions, that is, a

device soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

θJA

θJC

ΨJB

Unit

4-Ball, 0.5 mm Pitch WLCSP

260

58.4

°C/W

8-Lead, 2 mm × 2 mm LFCSP

72.1

42.3

47.1

°C/W

ESD CAUTION

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