ADP7102ACPZ-9.0-R7 datasheet(23/28 Pages) AD

部件名	ADP7102ACPZ-9.0-R7

功能描述	20 V, 300 mA, Low Noise, CMOS LDO

PDF	28 Pages

Scroll/Zoom	100%

制造商	AD [Analog Devices]

网页	http://www.analog.com

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23 / 28 page

Data Sheet

ADP7102

Rev. A | Page 23 of 28

In the case where the board temperature is known, use the

thermal characterization parameter, ΨJB, to estimate the

junction temperature rise (see Figure 77 and Figure 78).

Maximum junction temperature (TJ) is calculated from

the board temperature (TB) and power dissipation (PD)

using the following formula:

TJ = TB + (PD × ΨJB)

(5)

The typical value of ΨJB is 15.1°C/W for the 8-lead LFCSP

package and 31.3°C/W for the 8-lead SOIC package.

TOTAL POWER DISSIPATION (W)

100

120

140

0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0

TB = 25°C

TB = 50°C

TB = 65°C

TB = 85°C

TJ MAX

Figure 77. LFCSP

TOTAL POWER DISSIPATION (W)

100

120

140

0.5

1.0

1.5

2.0

2.5

3.0

3.5

TB = 25°C

TB = 50°C

TB = 65°C

TB = 85°C

TJ MAX

Figure 78. SOIC

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