ADP7104

Data Sheet

Rev. B | Page 6 of 28

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

NOTES

1. NC = NO CONNECT. DO NOT CONNECT TO

THIS PIN.

2. IT IS HIGHLY RECOMMENDED THAT THE

EXPOSED PAD ON THE BOTTOM OF THE

PACKAGE BE CONNECTED TO THE GROUND

PLANE ON THE BOARD.

3

GND

4

NC

1

VOUT

2

SENSE/ADJ

6 GND

5 EN/UVLO

8 VIN

7 PG

ADP7104

TOP VIEW

(Not to Scale)

Figure

3. LFCSP Package

NOTES

1. NC = NO CONNECT. DO NOT CONNECT TO

THIS PIN.

2. IT IS HIGHLY RECOMMENDED THAT THE

EXPOSED PAD ON THE BOTTOM OF THE

PACKAGE BE CONNECTED TO THE GROUND

PLANE ON THE BOARD.

VOUT

1

SENSE/ADJ

2

GND

3

NC

4

VIN

8

PG

7

GND

6

EN/UVLO

5

ADP7104

TOP VIEW

(Not to Scale)

Figure 4. Narrow Body SOIC Package

Table 5. Pin Function Descriptions

Pin No.

Mnemonic

Description

1

VOUT

Regulated Output Voltage. Bypass VOUT to GND with a 1 µF or greater capacitor.

2

SENSE/ADJ

Sense (SENSE). Measures the actual output voltage at the load and feeds it to the error amplifier.

Connect SENSE as close as possible to the load to minimize the effect of IR drop between the

regulator output and the load. This function applies to fixed voltages only.

Adjust Input (ADJ). An external resistor divider sets the output voltage. This function applies to

adjustable voltages only.

3

GND

Ground.

4

NC

Do Not Connect to this Pin.

5

EN/UVLO

Enable Input (EN). Drive EN high to turn on the regulator; drive EN low to turn off the regulator.

For automatic startup, connect EN to VIN.

Programmable Undervoltage Lockout (UVLO). When the programmable UVLO function is used,

the upper and lower thresholds are determined by the programming resistors.

6

GND

Ground.

7

PG

Power Good. This open-drain output requires an external pull-up resistor to VIN or VOUT. If the

part is in shutdown, current limit, thermal shutdown, or falls below 90% of the nominal output

voltage, PG immediately transitions low. If the power-good function is not used, the pin may be

left open or connected to ground.

8

VIN

Regulator Input Supply. Bypass VIN to GND with a 1 µF or greater capacitor.

EPAD

Exposed Pad. Exposed paddle on the bottom of the package. The EPAD enhances thermal

performance and is electrically connected to GND inside the package. It is highly recommended

that the EPAD be connected to the ground plane on the board.