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2DB1132P-13 数据表(PDF) 2 Page - Diodes Incorporated |
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2DB1132P-13 数据表(HTML) 2 Page - Diodes Incorporated |
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2 / 6 page ![]() 2DB1132P/Q/R Document number: DS31142 Rev: 5 - 2 2 of 6 www.diodes.com September 2011 © Diodes Incorporated 2DB1132P/Q/R Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Symbol Value Unit Collector-Base Voltage VCBO -40 V Collector-Emitter Voltage VCEO -32 V Emitter-Base Voltage VEBO -5 V Continuous Collector Current IC -1 A Peak Pulse Current (Note 4) ICM -2 A Thermal Characteristics @TA = 25°C unless otherwise specified Characteristic Symbol Value Unit Power Dissipation (Note 3) PD 1 W Thermal Resistance, Junction to Ambient (Note 3) RθJA 125 °C/W Thermal Resistance, Junction to Leads (Note 5) RθJL 22 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Notes: 3. For a device surface mounted on FR-4 PCB with minimum suggested pad layout; high coverage of single sided 1 oz copper, in still air conditions 4. Measured under pulsed conditions. Pulse width = 300µs. Duty cycle ≤ 2%. 5. Thermal resistance from junction to solder-point (at the end of the collector lead). 0 0.2 0.4 25 50 75 100 125 150 T , AMBIENT TEMPERATURE (°C) Fig. 1 Power Dissipation vs. Ambient Temperature (Note 3) A 0.6 0.8 1.0 0 |
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